The invention relates to a production process of a softness and hardness combined printed circuit board with a soft board at the outer layer. The production process comprises the following steps of: performing groove milling on a hard board layer at the inner layer; performing windowing on a first bonding sheet material layer; performing sequence overlapping on a single-sided copper soft board, the first bonding sheet material layer, the hard board layer at the inner layer, a second bonding sheet material layer and a copper foil material layer; drilling and electroplating; producing a vacuum pressed film; exposing; developing; etching; performing solder mask and surface treatment; cutting the second bonding sheet material layer and removing the hard board layer at the inner layer and the second bonding sheet material layer on the back of the single-sided copper soft board. According to the production process provided by the invention, the requirement of the softness and hardness combined circuit board with the soft board designed on the outer layer is ensured, a production process of blind milling production (blind milling butting) is removed, no blind milling equipment is needed for production, and the production limit of the softness and hardness combined circuit board with the soft board on the outer layer is reduced.