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Invention Publication
CN103380501A 具有低结温度的发光二极管 无效 - 撤回

具有低结温度的发光二极管
Abstract:
一种发光二极管芯片包括：支撑层，所述支撑层具有第一正面以及与第一正面相对的第二正面；在支撑层的第一正面上的二极管区；以及焊料垫，在支撑层的第二正面上。焊料垫包括金-锡结构，该金-锡结构具有50％或更大的锡重量百分比。发光二极管芯片可以包括多个活性区，这些活性区在发光二极管芯片上以电气串联方式相连接。
Abstract(English):

A light emitting diode chip a support layer having a first face and a second face opposite the first face, a diode region on the first face of the support layer, and a bond pad on the second face of the support layer. The bond pad includes a gold-tin structure having a weight percentage of tin of 50% or more. The light emitting diode chip may include a plurality of active regions that are connected in electrical series on the light emitting diode chip.

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