The invention provides a chip packaging structure and a manufacturing method thereof. The chip packaging structure comprises a bearing plate, a chip, a plurality of first conductive blocks and a molding compound, wherein the front of the bearing plate is provided with a plurality of bulged bonding pads; the chip is provided with an active surface, one end of each first conductive block is electrically connected with the active surface, and the other end of the first conductive block is electrically connected with corresponding bulged bonding pad; and the molding compound surrounds the chip and fills the space between the bearing plate and the chip. By means of the chip packaging structure and the manufacturing method thereof, the bulged bonding pads are formed in the front of the bearing plate through etching, a circulating channel between the chip and the bearing plate is increased for the molding compound when the bulged bonding pads are electrically connected with the active surface of the chip, so that the molding compound can fill up the space between the bearing plate and the chip, a bottom filling process is omitted before plastic package, and the package cost is reduced.