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CN103548430A 电子部件安装方法、电子部件搭载装置以及电子部件安装系统 失效 - 权利终止 转让

电子部件安装方法、电子部件搭载装置以及电子部件安装系统
摘要：
一种电子部件安装方法，包括：准备具有设置有多个凸块的主面的第一电子部件的工序；准备具有设置有与多个凸块对应的多个第一电极的搭载区域的基板的工序；在多个凸块上涂覆助熔剂的工序；在与搭载区域的周边缘部所设定的至少一个加强位置相邻接的第一电极上涂覆助熔剂的工序；在加强位置上涂覆热硬化性树脂，将与加强位置相邻接的第一电极的至少一部分由热硬化性树脂覆盖的工序；以多个凸块分别降落到对应的第一电极上的方式，将第一电子部件搭载到基板上，并且使热硬化性树脂与第一电子部件的周边缘部接触的工序；以及对搭载了第一电子部件的基板进行加热的工序。
摘要（英）：

Provided is an electronic component mounting method comprising the following steps: a step for preparing a first electronic component that has a primary surface whereon a plurality of bumps are provided; a step for preparing a substrate that has a loading region whereon are provided a plurality of first electrodes corresponding to the plurality of bumps; a step for coating the plurality of bumps with flux; a step for coating with flux the first electrodes adjacent to at least one reinforced position set to be on the outer edge of the loading region; a step for coating the reinforced position with thermoset resin and covering with thermoset resin at least a portion of the first electrodes adjacent to the reinforced position; a step for loading the first electronic component on the substrate such that the plurality of bumps are set to the corresponding first electrodes and for causing the thermoset resin to be in contact with the outer edge section of the first electronic component; and a step for heating the substrate whereon is loaded the first electronic component.

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