The invention provides a method for manufacturing a flip integrated LED chip light source module. The method includes the following steps that firstly, a GaN material grows on a substrate and a GaN epitaxial structure is formed; secondly, multiple isolated small LED structures are formed on the GaN epitaxial structure through a deep etching technology; thirdly, the isolated small LED structures undergo a flip LED chip manufacturing technology and P electrodes and N electrodes, which are in contact with the substrate, of multiple LED chips are manufactured; fourthly, the P electrodes and the N electrodes of the multiple flip LED chips are connected in parallel and series to form a flip LED integrated chip; fifthly, the substrate is polished, coated with fluorescent powder and cut into flip integrated chip particles, namely flip integrated LED chip light source modules. The flip integrated LED chip light source module manufactured with the method has the advantages of being good in heat dissipation, capable of being driven with large currents, high in light efficiency and the like.