A system for continuously disassembling and recovering an electronic component and solder based on a waste circuit board comprises an electric heating wire heating tube, a blast device, a temperature controller, a limit plate, a brush, a short chain transmission disassembling device, a long chain transmission auxiliary disassembling device, a circuit board substrate, an electronic component recovery box, an inclined type vibration screen, a solder recovering box and a harmful gas processing device. The waste circuit board is driven by the long chain transmission auxiliary disassembling device to pass through a material conveying port to enter the system, the waste circuit board is conveyed to the position below the heating tube, the solder at the position of a circuit pin is fast heated and fused, and part of the element and solder are disassembled through the blast wind force and under the action of gravity of an inclined angle. When the waste circuit board is continued to be conveyed to the short chain transmission disassembling device, the remaining element and solder are disassembled through a steel wire and a cutting board arranged on the short chain transmission disassembling device, and the falling element and the solder fall onto a vibration screen to be separated and recovered. The efficient system is simple and free of pollution and can continuously conduct batch processing on the circuit board without damaging the substrate.