The invention discloses a piezoelectric valveless micropump suction cup based on a parallel connection compliant mechanism. The piezoelectric valveless micropump suction cup based on the parallel connection compliant mechanism comprises a monocrystalline silicon substrate, a copper-based composite film, the compliant mechanism and a piezoelectric stack driver. The compliant mechanism is provided with a deformation displacement input part, a deformation displacement output part and a locating groove. The piezoelectric stack driver is fixedly clamped at a hollowed-out position in the upper portion of the deformation displacement input part and is closely attached to the deformation displacement input part. The copper-based composite film located on the upper layer and the monocrystalline silicon substrate located on the lower layer are bonded together and assembled through epoxy structure bonding glue to form a thin film micropump. The thin film micropump is clamped into the locating groove of the compliant mechanism and is sealed in a bonding mode. The lower end face of the deformation displacement output part is attached to the upper plane of the copper-based composite film in a bonding mode. The compliant mechanism amplifies unidirectional deformation displacement generated after the piezoelectric stack driver is powered on, and then transmits the unidirectional deformation displacement to the copper-based composite film to drive the thin film micropump to operate, gas in an adsorption cavity formed in the lower portion of the monocrystalline silicon substrate is extracted, and negative pressure of the suction cup is generated. The piezoelectric valveless micropump suction cup based on the parallel connection compliant mechanism is small in size, light in weight, free of noise, and capable of being used as an adsorption device of a wall-climbing robot.