The invention relates to a packaging body of a semiconductor member and a making method thereof; more specifically, the invention relates to the following steps; a chip is integrately packaged in a wafer level packaging element, so no portion of the chip is exposed outside a plastic packaging body; a thick metal bottom pedestal is arranged on the bottom of the chip; firstly, covering a plastic packaging layer on the front side of the wafer, grinding and reducing the thickness of the wafer, covering a metal layer on the backside of the wafer, pasting the bottom pedestal on the bottom metal layer on the backside of the chip, and cutting and separating the chip into the wafer level packaging element with a plurality of bottom pedestals.