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发明公开
CN103681557A 半导体器件及其组装方法 有权

半导体器件及其组装方法
摘要：
本发明涉及一种半导体器件及其组装方法，半导体器件具有由单片导电材料整体形成的管芯支撑件和外部引线。管芯安装衬底安装在管芯支撑件上，其中键合焊盘耦合到衬底的外部连接器侧上相应的外部连接焊盘。管芯通过管芯连接焊盘附连到管芯安装衬底。键合线将管芯连接焊盘选择性地电耦合到外部引线和键合焊盘，并且导电外部凸起安装到外部连接焊盘。包封剂覆盖管芯和键合线。外部凸起位于封装体的表面安装侧的中心区域，并且外部引线从靠近管芯支撑件的位置朝向封装体的外围边缘向外凸出。
摘要（英）：

The invention relates to a semiconductor device and an assembly method thereof. The semiconductor device comprises a die supporter formed integrally from a single conductive material, and an external lead. A die mounting substrate is mounted on the die supporter, wherein a bonding pad is coupled with a corresponding outer connection pad on an outer connector side of a substrate. A die is connected with the die mounting substrate through the die connection pad. The die connection pad is selectively electrically coupled to the external lead and the bonding pad through a bonding wire; a conductive external boss is mounted on an outer connection pad. An encapsulant covers the die and the bonding wire. The external boss is located at a center region of a surface mounting side of a package body; and the external lead protrudes outwards from a position close to the die supporter to the outer edge of the package body.

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