The invention relates to the technical field of etching solution for producing circuits in the manufacturing of printed circuit boards, in particular to a novel organic alkali micro-etching solution for forming the circuits through the a semi-additive process. The novel organic alkali micro-etching solution consists of components with the following components by mass: 0.1-15% of cupric ionization compound, 1-40% of organic alkali, 0.0001%-10% of complexing additive, 0.0001%-5% of halogen compound and the balance of water; the sum of the components in percentages by weight is 100%; the cupric ionization compound is calculated by the mass of copper ion; the halogen compound is calculated by the mass of halogen ion. The novel organic alkali micro-etching solution can completely etch seed copper layers without damaging nickel layers and gold layers, and restrains the over-etching and bottom-layer undercutting of the circuit copper layers.