The invention relates to an adhesive and a preparation method thereof and in particular relates to an anticorrosive acid-resistant epoxy resin adhesive used for electronic packaging and a preparation method thereof. The anticorrosive acid-resistant epoxy resin adhesive comprises a component A and a component B, wherein the component A comprises 50-55 parts of maleic anhydride, 5-8 parts of polyethylene and 2-4 parts of zirconium aluminate coupling agent; the component B comprises 100-110 parts of bisphenol-type A epoxy resin, 40-50 parts of furfural acetone resin, 25-27 parts of vinyl trimethoxy silane, 5-6 parts of dodecyl glycidyl ether, 4-7 parts of methyl butanone, 6-8 parts of tertiary amine, 2-3 parts of mica powder, 3-4 parts of titanium dioxide, 4-6 parts of quartz powder and 1-3 parts of alumina. The anticorrosive acid-resistant epoxy resin adhesive provided in the invention is used for achieving the effects of fixation and moisture prevention in the process of producing electron components. Because multiple modifiers and composite fillers are utilized, the performance of the adhesive is enhanced, and the adhesive has excellent corrosion resistance and acid resistance, particularly under some conditions with corrosion resistance and high acidity.