The invention discloses a method for forming a welding pad. The method for forming the welding pad comprises the following steps: providing a device for a to-be-formed welding pad, wherein the device comprises a first device layer, an interconnection layer on the first device layer and a medium layer on the interconnection layer, the medium layer is internally provided with plugs, the device comprises a first area and a second area, the interconnection layer acts as a part of the welding pad, the upper surface of the interconnection layer in the first area is lower than that in the second area, the height of the plugs in the first area is less than the thickness of the medium layer, and the height of the plugs the second area is equal to the thickness of the medium layer; removing plugs with certain heights in the first area and the second area by first dry etching; and removing residual plugs in the first area and the second area and the parts of the medium layer in the first area and the second area by second dry etching so as to expose the interconnection layer parts in the first area and the second area, wherein the exposed interconnection layer acts as the welding pad, and an etching gas used by second dry etching is an etching gas used for etching the medium layer. According to technical scheme, the conductivity of the welding pad in the second area can be improved.