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发明授权
CN103811390B 晶粒定位装置、晶粒定位系统与晶粒定位方法 失效 - 权利终止

晶粒定位装置、晶粒定位系统与晶粒定位方法
摘要：
本发明揭露一种晶粒定位装置、晶粒定位系统与晶粒定位方法。晶粒定位装置包含滚筒本体、多个晶粒吸取部与至少一气体控制装置。滚筒本体其内具有多个彼此互相隔离的空腔。晶粒吸取部条列位于滚筒本体表面。每一条列的晶粒吸取部是对应于一空腔，且每一晶粒吸取部均分别具有晶粒吸附区以及贯穿晶粒吸附区的气体通道。气体控制装置连接空腔，且设置于滚筒本体上。气体控制装置可选择性地对空腔抽气，使得每一位于抽气空腔上的晶粒吸取部可通过其气体通道将晶粒吸附至其晶粒吸附区，而当气体控制装置停止对抽气空腔抽气时，被吸附的晶粒将被释放至一预定位置。
摘要（英）：

A die-positioning device includes a roller body, a plurality of die-suction portions, and at least one gas control device. The roller body includes a plurality of chambers therein, and the chambers are separated from each other. The die-suction portions are located on the surface of the roller body in columns. The die-suction portions for each column correspond to one of the chambers, and each of the die-suction portions has a die suction region and a gas channel that passes through the die suction region. The gas control device is connected to the chambers and disposed on the roller body. The gas control device selectively sucks the air from a specific chamber, such that each of the die-suction portions on the specific chamber sucks an LED die by the corresponding gas channel.

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