An opto-electrichybrid board being excellent both in flexibility and in mounting workability with an element such as an optical element during the ultrasonic mounting process, and a method of manufacturing the same are provided. An opto-electric hybrid board includes: an electric circuit board (E) including an insulative layer (1), and an element mounting electrode (2a) formed on the front surface of the insulative layer (1) ; an optical element (4) mounted on the element mounting electrode (2a) through use of contact frictional heat; and an optical waveguide (W) including a first cladding layer (6) in contact with the back surface of the insulative layer (1) of the electric circuit board (E). Between the insulative layer (1) and the first cladding layer (6), a metal-made reinforcing layer (M) is provided at the portion corresponding to the element mounting electrode (2a). A resin-made reinforcing layer (R) is provided at the portion corresponding to the element mounting electrode (2a), in the surface of the first cladding layer (6), which is on the side opposite to the insulative layer (1). The resin-made reinforcing layer (R) is set to be greater than the first cladding layer (6) in storage modulus at the temperature of the opto-electric hybrid board when the element is being mounted.