Provided is a soft element taking-out method. The method comprises providing first support plates, the first surfaces of the first support plates are provided with first release areas, and first soft substrates are attached to the first release areas; the method also comprises providing second support plates, the first surfaces of the second support plates are provided with second release areas, and second soft substrates and at least one of soft element are successively attached to the second release areas; the method further comprises joining the first support plates and the second support plates and allowing the first surfaces of the first support plates to face the first surfaces of the second support plates; and the method comprises carrying out the first taking out step in which the first support plates are separated from the first soft substrates. The first taking out step at least comprises charging fluid into space between lower layers of two first support plates, so positive pressure is formed in the space. The invention also provides a substrates separating method.