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发明授权
CN103874788B 金属过滤器的制造方法 失效 - 权利终止 复审申请

金属过滤器的制造方法
摘要：
本发明提供一种金属过滤器的制造方法，其包含下述工序：层叠工序，该工序是在铜基板上层叠感光性树脂组合物而形成感光性树脂组合物层；曝光工序，该工序是对感光性树脂组合物层的规定部分照射活性光线，使被曝光的部分发生光固化而形成感光性树脂组合物的固化物；显影工序，该工序是将感光性树脂组合物层中的感光性树脂组合物的固化物以外的部分通过显影而除去，在铜基板上形成由感光性树脂组合物的固化物构成的抗蚀图案；镀覆工序，该工序是对形成了抗蚀图案的铜基板进行金属镀覆而形成镀层；溶解工序，该工序是通过化学溶解而除去铜基板，从而得到由镀层和感光性树脂组合物的固化物构成的结构物；以及剥离工序，该工序是从结构物中除去感光性树脂组合物的固化物，从而得到镀层，其中，镀层是金属过滤器。该金属过滤器的制造方法能够制造没有皱纹、折断、划痕、卷曲等损伤以及微细贯通孔的变形的金属过滤器，因而是有用的。
摘要（英）：

A method for producing a metal filter comprising a lamination step of laminating a photosensitive resin composition on a copper substrate to form a photosensitive resin composition layer, an exposure step of irradiating a predetermined portion of the photosensitive resin composition layer with an active light and light-curing the exposed portion to form a cured material of the photosensitive resin composition, a development step of removing a portion other than the cured material of the photosensitive resin composition of the photosensitive resin composition layer by development to form a resist pattern composed of the cured material of the photosensitive resin composition on the copper substrate, a plating step of metal plating the resist-patterned copper substrate to form a plated layer, a dissolution step of removing the copper substrate with chemical dissolution to obtain a structure composed of the plated layer and the cured material of the photosensitive resin composition, and a stripping step of removing the cured material of the photosensitive resin composition from the structure to obtain the plated layer, wherein the plated layer is the metal filter is useful because it is possible to produce a metal filter in which there are not damages such as wrinkles, folds, scars, and curls and deformation of fine through-holes.

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