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CN103897344A 用于封装半导体器件的环氧树脂组合物以及使用其封装的半导体器件 有权

用于封装半导体器件的环氧树脂组合物以及使用其封装的半导体器件
摘要：
一种环氧树脂组合物和使用其封装的半导体器件，该环氧树脂组合物包含：环氧树脂；固化剂；固化促进剂；以及无机填料，其中固化促进剂包括由式1表示的四价铵盐或四价鳞盐，其中，A1是氮或磷；R1、R2、R3和R4各自独立地是取代或未取代的C1至C30烃基或取代或未取代的包括杂原子的C1至C30烃基；X1、X2、X3、X4、X5和X6各自独立地是氧原子(O)、硫原子(S)、或NH；并且Y1、Y2和Y3各自独立地是取代或未取代的C1至C30烃基或取代或未取代的包括杂原子的C1至C30烃基。环氧树脂组合物在固化性、室温储存稳定性、流动性、抗裂性、耐湿性等方面表现出优异的性能。[式1]
摘要（英）：

An epoxy resin composition includes: an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt represented by Formula 1, wherein A1 is nitrogen or phosphorus; R1, R2, R3 and R4 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom; X1, X2, X3, X4, X5 and X6 are each independently an oxygen atom (O), a sulfur atom (S), or NH; and Y1, Y2 and Y3 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom.

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