The invention discloses an integrated solder and an electronic packaging case brazing mounting tool, and relates to the field of machining of airtight packaging cases of electronic products and photoelectric electronic products. The integrated solder consists of at least two solder rings and solder ribs for connecting all the solder rings integrally. The electronic packaging case brazing mounting tool comprises a substrate and a plurality of leading wires, wherein soldering holes in the same number as that of the leading wires are formed in the substrate; the integrated solder is also provided with the soldering rings which are in the same number as that of the leading wires; the leading wires are sleeved with convex ribs; the integrated solder is paved on the substrate; the leading wires are inserted into the solder rings and the soldering holes; the bottom sides of the convex ribs are propped against the upper surfaces of the solder rings. When the solder is used, correspondingly required solder amount is shorn according to the number of the leading wires; because the solder adopts an integrated structure, the solder can be positioned at one time when being mounted, and then the leading wires can be mounted directly; therefore, a cumbersome single solder circle installation process is avoided; the mounting time is saved; the production efficiency is improved; moreover, the product consistency is very good.