The invention discloses an epoxy modified moisture curing polyurethane hot melt adhesive for compounding fabrics. The epoxy modified moisture curing polyurethane hot melt adhesive for compounding the fabrics is characterized by comprising the following components according to the mass content: 46 parts of polyether polyol, 22 parts of polyester polyol, 0.5 part of epoxy resin, 0.4 part of an antioxidant, 16 to 18 parts of tackifying resin, 13 to 14 parts of 4, 4'-diphenylmethane diisocyanate (MDI), 0.1 part of a catalyst, 0 to 0.5 part of a chain extender and 0 to 1.5 parts of a silane coupling agent. The preparation of the epoxy modified moisture curing polyurethane hot melt adhesive comprises the following steps of: (1) selecting raw materials; (2) mixing polyol with the antioxidant, and dehydrating for 0.5 hour; (3) increasing the tackifying resin and dehydrating for 1.5 hours; (4) adding MDI and the catalyst at the temperature of 87 DEG C and reacting for 70 minutes at the temperature of 85 to 90 DEG C; (5) adding 1,4-butanediol, and reacting for 50 minutes; (6) adding the silane coupling agent at the temperature of 70 to 80 DEG C, and reacting for 1 hour; (7) under the protection of nitrogen, discharging and carrying out sealed package. The epoxy modified moisture curing polyurethane hot melt adhesive for compounding the fabrics disclosed by the invention has the advantages of high peel intensity, good initial adhesion, short opening time, good hydrolysis resistance performance, environmental protection and the like.