The invention belongs to the technical field of glass, and particularly relates to LED glass and a manufacturing technology of the LED glass. The technical problem that a conducting circuit in existing LED glass is prone to falling off due to the poor adhesive force between the conducting circuit and silicon dioxide is solved. A silicon dioxide layer is plated on a glass substrate so as to prevent sodions in the glass from being diffused and prevent a film layer from being discolored. A first transition layer and a second transition layer are formed on the silicon dioxide layer through one-time film plating, then a first circuit and a second circuit are respectively formed through one-time yellow light etching, and production efficiency is high. A conducting layer is plated on the silicon dioxide layer, a conducting circuit is formed through yellow light etching, and an LED light emitting body is arranged on the conducting circuit. Due to the fact that metal which is large in chemical bond energy and good in combining effect is selected as the first transition layer and the second transition layer, the adhesive force between the conducting circuit and the silicon dioxide layer is improved, the conducting circuit and the silicon dioxide layer are firmly connected, and therefore the service life of the LED glass is prolonged.