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发明公开
CN104031355A 含羧基聚醚腈砜酮共聚物固化改性环氧树脂组合物、制备方法及其应用 无效 - 撤回

  • 专利标题： 含羧基聚醚腈砜酮共聚物固化改性环氧树脂组合物、制备方法及其应用
  • 专利标题（英）： Epoxy resin composition cured and modified by carboxyl-containing polyether nitrile sulphone ketone copolymer as well as preparation method and application of epoxy resin composition
  • 申请号： CN201410287267.3
    申请日： 2014-06-24
  • 公开(公告)号： CN104031355A
    公开(公告)日： 2014-09-10
  • 发明人: 王忠刚 , 田孟辙
  • 申请人： 大连理工大学
  • 申请人地址： 辽宁省大连市甘井子区凌工路2号
  • 专利权人： 大连理工大学
  • 当前专利权人： 大连理工大学
  • 当前专利权人地址： 辽宁省大连市甘井子区凌工路2号
  • 代理机构： 大连理工大学专利中心
  • 代理商 赵连明; 梅洪玉
  • 主分类号： C08L63/00
  • IPC分类号： C08L63/00 ;  C08L81/06 ;  C08J5/04
含羧基聚醚腈砜酮共聚物固化改性环氧树脂组合物、制备方法及其应用
摘要：
本发明公开了一种含羧基聚芳醚腈砜酮共聚物固化改性环氧树脂的组合物及其复合材料制备方法。该组合物包括环氧树脂、含羧基聚芳醚腈砜酮共聚物、固化剂和固化促进剂，其中环氧树脂的环氧基团数与聚芳醚腈共聚物所含羧基基团数之比为100:1～1:100，环氧树脂与固化剂的重量比为1:10～50:1，固化促进剂的量为环氧树脂组合物总重量的0.1％～5％。该组合物的有机溶液可用于环氧绝缘漆、胶黏剂、涂料和制备复合材料的预浸料等。本发明的有益效果是，它能够使环氧固化物韧性得到显著改善的同时，其耐热性有明显的提高，可满足耐150℃及以上高温环境的使用要求，在特种电子绝缘材料、耐高温涂料、层压板和先进复合材料等领域具有广泛的用途。
摘要（英）：

The invention discloses an epoxy resin composition cured and modified by carboxyl-containing polyether nitrile sulphone ketone copolymer and a preparation method of the modified epoxy resin composition. The epoxy resin composition comprises epoxy resin, the carboxyl polyether nitrile sulphone ketone copolymer, a curing agent and a curing accelerator, wherein ratio of number of epoxy groups to the number of carboxyl groups contained in the polyether nitrile sulphone ketone copolymer is (100 to 1)-(1 to 100), weight ratio of the epoxy resin to the curing agent is (1 to 10)-(50 to 1), and the weight of the curing accelerator is 0.1-5% of the total weight of the epoxy resin composition. An organic solution of the epoxy resin composition can be applied to epoxy insulating paint, adhesive, coating and prepreg used for preparing a composite material. The epoxy resin composition has the beneficial effects that toughness of cured epoxy can be obviously improved, heat resistance of the cured epoxy is obviously improved, operating requirements of resisting to an environment at the temperature of 150 DEG C and above can be met, and the epoxy resin composition can be widely applied to the fields of special electronic insulating materials, high temperature resistant coating, laminated boards, advanced composite materials and the like.

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