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发明公开
CN104040703A 具有顶部基板支撑组件的热处理腔室 失效 - 权利终止

具有顶部基板支撑组件的热处理腔室
摘要：
本发明的实施方式提供热处理腔室，所述热处理腔室包括设置在基板支撑组件的相对侧上的加热组件与驱动机构。特定而言，加热组件设置在基板支撑组件下方以处理以器件面朝上的基板且驱动机构设置在基板组件上方。
摘要（英）：

Embodiments of the present invention provide thermal processing chambers including a drive mechanism and a heating assembly disposed on opposite sides of a substrate support assembly. Particularly, the heating assembly is disposed below the substrate support assembly to process a substrate with a device side facing up and the drive mechanism is disposed above the substrate assembly.

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