The invention discloses a frit composition which comprises a frit base material and filler, wherein the filler comprises a quasi-crystal material which accounts for 5-45wt% of the total weight of the filler. The frit composition, and the frit paste composition have negative thermal expansion coefficients, the thermal expansion coefficient of the frit can be reduced very well, so that the expansion coefficients of the frit and the base plate are further matched. Furthermore, a channel for discharging gross blow holes is provided and the compactness and adhesive strength of the frit composition are improved, so that the packaging yield is further improved and the OLED (Organic Light Emitting Diode) packaging stability is improved.