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发明授权
CN104064477B 制造半导体装置的方法和半导体装置 有权

制造半导体装置的方法和半导体装置
摘要：
为了提高半导体装置的倒装芯片焊接的连接可靠性。在半导体装置的制造中使用下述的配线基板，在该配线基板中，横跨该配线基板上表面上的阻焊膜的开口区域的配线的一侧上具有凸点电极，另一侧上具有其上无凸点电极的多个宽幅部分，通过使用上述的配线基板可以在焊料预涂覆步骤中的回流处理期间将所述配线上的焊料分散至各个宽幅部分。这样的配置可以减小各端子上的焊料和各宽幅部分上的焊料之间的高度差，从而增强倒装芯片焊接中的连接可靠性。
摘要（英）：

To improve coupling reliability in flip chip bonding of a semiconductor device. By using, in the fabrication of a semiconductor device, a wiring substrate in which a wiring that crosses an opening area of a solder resist film on the upper surface of the wiring substrate has, on one side of the wiring, a bump electrode and, on the other side, a plurality of wide-width portions having no bump electrode thereon, a solder on the wiring can be dispersed to each of the wide-width portions during reflow treatment in a solder precoating step. Such a configuration makes it possible to reduce a difference in height between the solder on each of terminals and the solder on each of the wide-width portions and to enhance the coupling reliability in flip chip bonding.

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