The invention discloses a measuring method for diamond coating film-substrate interface bonding strength based on molecular dynamics. The method is mainly characterized in that with the help of the molecular dynamics theory and simulating calculation software, a hard alloy substrate diamond coating film-substrate interface model is established, simulating calculation is performed on the mechanical property of a film-substrate interface, a hard alloy substrate diamond coating film-substrate interface bonding strength predicating model is established based on a simulating result, and the diamond coating film-substrate interface bonding strength is accurately measured through the predicting model. In this way, the defects that various existing experimental measurement methods, such as a scraping method, an indentation method and a bubbling method, are long in consumed time and low in measuring accuracy are overcome, a basis and a foundation can be provided for optimizing and industrializing a diamond coating technology, and the measuring method has wide application prospects.