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发明公开
CN104159872A 接合体及半导体模块 无效 - 驳回 复审申请

接合体及半导体模块
摘要：
本发明提供将金属、陶瓷、半导体任一种粘接的接合体，能够使接合体的粘接性和热传导性提高。接合体，将金属、陶瓷、半导体中任一种的第一部件和第二部件粘接而成，其经由设于所述第一部件的面的粘接部件粘接所述第二部件，所述粘接部件包含含有V2O5的玻璃和金属粒子。半导体模块，具备：基底金属、陶瓷基板、金属配线以及半导体芯片，其经由设于所述基底金属的面的第一粘接部件粘接所述陶瓷基板，经由设于所述陶瓷基板的面的第二粘接部件粘接所述金属配线，经由设于所述金属配线的面的第三粘接部件粘接所述半导体芯片，所述第一粘接部件、第二粘接部件以及第三粘接部件包含含有V2O5的玻璃和金属粒子。
摘要（英）：

To improve adhesion and thermal conductivity of an assembly in which a metal, a ceramic or a semiconductor is bonded. An assembly, which is obtained by bonding a second member with a first member that is a metal, a ceramic or a semiconductor, and wherein; the second member is bonded via an adhesive member that is provided on a surface of the first member; and the adhesive member contains V2O5-containing glass and metal particles. A semiconductor module, which is provided with a base metal, a ceramic substrate, a metal wiring line and a semiconductor chip, and wherein: the ceramic substrate is bonded via a first adhesive member that is provided on a surface of the base metal; the metal wiring line is bonded via a second adhesive member that is provided on a surface of the ceramic substrate; the semiconductor chip is bonded via a third adhesive member that is provided on a surface of the metal wiring line; and the first adhesive member, the second adhesive member and the third adhesive member contain V2O5-containing glass and metal particles.

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