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发明公开
CN104183577A 具有压接互连的柔性基板 无效 - 驳回 复审申请

具有压接互连的柔性基板
摘要：
本公开涉及具有压接互连的柔性基板。本发明公开了一种半导体器件，该半导体器件包括各自具有第一及第二外周边缘的第一及第二柔性基板。第一及第二管芯贴附于柔性基板各自的表面上并且各自分别电连接至第一及第二金属迹线。第一压接结构将第一金属迹线电连接至第二金属迹线，并且将第一及第二基板的第一外周边缘压接在一起。第二压接结构将第一金属迹线电连接至第二金属迹线，并且将第一及第二基板的第二外周边缘压接在一起。
摘要（英）：

The invention discloses a flexible substrate with crimping interconnection. A semiconductor device includes first and second flexible substrates each with first and second peripheral edges. First and second dies are attached on respective surfaces of the flexible substrates and are each respectively electrically connected to first and second metal traces. A first crimping structure electrically connects the first metal traces to the second metal traces and crimps together the first peripheral edges of the first and second substrates. A second crimping structure electrically connects the first metal traces to the second metal traces and crimps together the second peripheral edges of the first and second substrates.

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