Provided are a circuit connection material with which the intended peelable film can be peeled, and a manufacturing method for an assembly using same. The circuit connection material comprises a first adhesive layer (11) and a second adhesive layer (12), which contains a surface modifier. The peel force at ordinary temperature (25°C) of the first peelable film (21), which is affixed on the first adhesive layer (11) side, is smaller than the peel force of the second peelable film (22), which is affixed to the second adhesive layer (12) side. The first peelable film (21) is thereby made to be peelable at ordinary temperature and the second peelable film (22) is made to be peelable when heated.