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CN104271783A 用作端子或连接器材料的铜合金板及用作端子或连接器材料的铜合金板的制造方法 有权

用作端子或连接器材料的铜合金板及用作端子或连接器材料的铜合金板的制造方法
摘要：
本申请的用作端子或连接器材料的铜合金板含有4.5～12.0质量％的Zn、0.40～0.9质量％的Sn、0.01～0.08质量％的P及0.20～0.85质量％的Ni，剩余部分包括Cu及不可避免杂质，具有11≤[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]≤19的关系，并且，Ni为0.35～0.85质量％时，具有7≤[Ni]/[P]≤40的关系，平均结晶粒径为2.0～8.0μm，圆形或椭圆形的析出物的平均粒径为4.0～25.0nm或者在所述析出物中粒径为4.0～25.0nm的析出物所占的个数比例为70％以上，导电率为29％IACS以上，作为耐应力松弛特性在150℃、1000小时的条件下应力松弛率为30％以下，弯曲加工性在W弯曲中为R/t≤0.5，焊料润湿性优异，杨氏模量在100×103N/mm2以上。
摘要（英）：

This copper-alloy plate for a terminal/connector material: contains 4.5-12.0 mass% of Zn, 0.40-0.9 mass% of Sn, 0.01-0.08 mass% of P and 0.20-0.85 mass% of Ni, with inevitable impurities and Cu constituting the remainder thereof; satisfies the relationship 7<=Ni/P<=40 when satisfying the relationship 11<=Zn+7.5Sn+16P+3.5Ni<=19 and containing 0.35-0.85 mass% of Ni; has an average crystal particle diameter of 2.0-8.0[mu]m; has an average particle diameter of the circular or elliptical precipitate of 4.0-25.0nm, or contains a proportion of the number of precipitate particles having a particle diameter of 4.0-25.0nm among the precipitate particles of 70% or higher; has a conductivity of 29% IACS or higher; in terms of stress relaxation resistance properties, exhibits a percentage of stress relaxation after 1000 hours at 150 DEG C of 30% or lower; has a bending workability when W-bending of R/t<=0.5; exhibits excellent solder wettability; and has a Young's modulus of 100103N/mm2 or higher.

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