The invention discloses a flip-over type light-emitting diode packaging module and a manufacturing method of the flip-over type light-emitting diode packaging module. The method includes the following steps of providing a bearing body, wherein a plurality of light-emitting diode chips are arranged on the bearing body; conducting the glue sealing process so as to form a plurality of transparent packaging bodies which correspond to and wrap the light-emitting diode chips, wherein the peripheries of all the transparent packaging bodies form side wing portions so that the transparent packaging bodies can be connected with one another; conducting the separation process so as to form a plurality of single flip-over type light-emitting diode structures containing no bearing body; conducting the connection process, and connecting at least one flip-over type light-emitting diode structure to a circuit substrate.