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发明公开
CN104340947A MEMS器件的装配和封装 有权

MEMS器件的装配和封装
摘要：
MEMS器件的装配和封装。微机电系统（MEMS）器件包括在衬底上的焊料凸块、包含CMOS管芯和MEMS管芯的CMOS-MEMS管芯、以及在所述CMOS管芯上的柱形凸块。MEMS管芯被布置在CMOS管芯和衬底之间。柱形凸块和焊料凸块被定位成提供在CMOS管芯和衬底之间的电连接。
摘要（英）：

Provided are assembly and packaging of an MEMS device. A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.

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