The invention discloses a wafer encapsulation and a method for forming the same. The wafer encapsulation, comprises a device substrate having an upper surface, a lower surface, and a side wall; the device substrate comprises a sensing area or an element area adjacent to the upper surface, a signal receiving pad area, and a shallow groove structure extending from the upper surface towards the lower surface along the side wall of the device substrate. A rewiring layer is electrically connected to the signal receiving pad area and extends to the shallow groove structure. A first substrate is arranged under the lower surface of the device substrate and between the device substrate and a second substrate. A first end point of a wiring is electrically connected to the rewiring layer in the shallow groove structure; and a second end point of the wiring is electrically connected with the first substrate and/or the second substrate. The wafer encapsulation increases the sensitivity of the sensing area or the element area, reduces sieze, and improves quality.