A heat dissipation device for electronic controllers, is provided and includes a housing that has a hollow portion into which a working fluid for heat transfer and dissipation is filled. The housing of the electronic controller is formed to have the hollow portion using the material containing the heat-conductive filler and the heat transfer working fluid is filled in the hollow portion, to improve the cooling efficiency and achieving the weight reduction. By forming the condensation unit that condenses the vaporized working fluid in the upper end portion relative to the working fluid filled in the hollow portion of the housing, the heat exchange effect of the working fluid may be maximized.