An electronic component mounting structure comprises: a substrate; a conductive wiring pattern mainly comprised of a high-melting point metal such as Cu formed on the surface of the substrate; and an electronic component which has an external terminal and is mounted at a mounting location on the surface of the substrate, said mounting location encompassing a terminal joint on the conductive wiring pattern. At the terminal joint, the external terminal is joined to the conductive wiring pattern while immersed inside the conductive wiring pattern. Thus, compared with a joint where the external terminal of an electronic component and a conductive wiring pattern are merely joined on the surface of the conductive wiring pattern, the external terminal and the conductive wiring pattern may be joined by a higher-strength joint.