An electronics chassis has many removable boards (50) on sleds (30) that are interconnected by a honeycomb interconnect structure. Interconnect boards (10, 12) in Y-planes and Z-planes are orthogonal to each other and form cells. Cooling air flows through the cells in an X direction, parallel to surfaces of the interconnect boards. The removable boards have connectors (40, 42, 44) that mate with an edge of Z-divider interconnect boards (14). Fans blow air through the cells in the honeycomb structure unimpeded since no boards are perpendicular to the airflow. Notches in the rear of the Z-divider boards provide airflow equalization allowing closer spacing of fans to the honeycomb structure. A sled carrier honeycomb structure (16, 18, 19) is placed in front of the honeycomb interconnect structure to guide sleds into position. Sled carrier dividers (16) are offset from the Z-divider boards to allow removable boards to align with Z-divider boards in the Zplanes, parallel to airflow.