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发明授权
CN104508760B 绝缘树脂材料及多层基板 有权

绝缘树脂材料及多层基板
摘要：
本发明提供一种绝缘树脂材料，其在能够减小固化物表面的表面粗糙度、进一步在固化物表面形成金属层的情况下，能够提高固化物与金属层的粘接强度。本发明涉及的绝缘树脂材料包含热固化性树脂、固化剂、经第一硅烷偶联剂进行表面处理的第一无机填充材料、和经第二硅烷偶联剂进行表面处理的第二无机填充材料。将含量最多的热固化性树脂的SP值与上述第一硅烷偶联剂的有机基团的SP值之差的绝对值设为SP(A)、含量最多的热固化性树脂的SP值与上述第二硅烷偶联剂的有机基团的SP值之差的绝对值设为SP(B)时，(SP(A)‑SP(B))为0.5以上且3.5以下。
摘要（英）：

Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer. The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)−SP(B)) is not smaller than 0.5 but not larger than 3.5.

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