A mounting method of mounting chips on a substrate includes a temporarily-bonding process of temporarily individually bonding the chips on the substrate, and a main-bonding process of firmly individually bonding, on the substrate, the chips temporarily bonded on the substrate. The temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips to be mounted on the substrate. The first basic process includes a first step and a second step. The first step is to align, on a first metal layer of the substrate, a second metal layer of each chip. The second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. The main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips on the substrate. The second basic process includes a third step and a fourth step. The third step is to recognize a position of each chip temporarily mounted on the substrate. The fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.