The invention discloses an IC (integrated circuit) chip encapsulation device. The IC chip encapsulation device comprises a supporting frame, wherein the supporting frame comprises a main runner supporting base, a material storage tank, a material pushing hydraulic cylinder, a nozzle, a pressure runner pipeline, a base, a lower mould base, a lower mould, a supporting rod, a top plate, a hydraulic cylinder and an upper mould. Compared with the prior art, the dispensed IC chip is put into the lower mould, the hydraulic cylinder pushes the upper mould to move downwards and to be combined tightly and sealed with the lower mould; the material pushing hydraulic cylinder pushes liquid plastic which is pressurized through the pressure runner pipeline, so that the plastic quickly flows into the mould to complete IC chip encapsulation; cold water flows through a cooling water hole to cool the mould, so that the plastic is quickly solidified and the solidified plastic is ejected through an ejector pin, quick encapsulation is achieved, and the production efficiency is improved.