The invention discloses a full-automatic laser spot welding device for an IC chip. The full-automatic laser spot welding device for the IC chip comprises a rack, an IC chip, a fixing seat, a servo motor, a lead screw, a movable installation seat, a laser welding head, a pneumatic vacuum sucker, a rotating servo motor, a wire welding machine and a conveyor. The chip to be machined is placed in a storage frame of the conveyor at first, the servo motor drives the movable installation seat and enables the pneumatic vacuum sucker to move to the center of the upper end of the conveyor, the pneumatic vacuum sucker moves downwards and sucks the chip to be machined, the servo motor drives the movable installation seat to move back again, the pneumatic vacuum sucker places the chip to be machined in a positioning die, a thin copper wire is conveyed to the welding position of the IC chip through the wire welding machine, the laser welding head emits high-energy electron beams, and therefore welding machining of the chip is completed. After one side of the chip is successfully machined, the rotating servo motor rotates to enable the IC chip to be changed to another direction for welding machining, and therefore full-automatic welding machining is achieved, and production efficiency is improved.