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发明公开
CN104661425A 具有陶瓷嵌体的电路板 无效 - 撤回

具有陶瓷嵌体的电路板
摘要：
指出实施成装配有电部件(200)的电路板(100)。电路板具有多个相叠地布置的带状导线平面(110，120，130)，其中分别两个相邻带状导线平面通过隔离层(190A，190B，190C，190D)相对彼此隔离。电路板其特征在于，在第一外部隔离层和第二外部隔离层之间布置具有陶瓷的热传导元件(300)。因此如此构建的电路板不仅实现热良好传导性而且实现相对电压电弧的电隔离。
摘要（英）：

The invention discloses a printed circuit board (100), which is designed to be fitted with electrical components (200). The circuit board has a plurality of stacked interconnect layers (110, 120, 130), each two adjacent interconnect layers are insulated from each other by an insulating layer (190A, 190B, 190C, 190D). The circuit board is characterized in that between a first outer insulating layer and a second outer insulation layer, a thermally conductive member (300) is arranged, which has ceramic. This enables a circuit board thus constituted both a thermal conductivity and good electrical insulation against flashovers.

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