Full-automatic PCB tin dipping equipment comprises a frame and a circuit control part. A roof slide bar is disposed at the top of the frame. A fixed arm and a slide arm are disposed on the roof slide bar. The fixed arm is disposed at the tail end of the roof slide bar. The slide arm is slidably disposed on the roof slide bar. A lifting groove is formed in the middle of each of the fixed arm and the slide arm. The lifting grooves are connected with a lifting drive motor. A transverse rod is disposed at the tail end of each of the fixed arm and slide arm. A plurality of grippers are disposed on each transverse rod. The full-automatic PCB tin dipping equipment has the advantages that the fixed arm and the slide arm which can be adjusted automatically are matched, the clamping grippers are disposed at the tail end of each of the fixed arm and the slide arm, power is precisely output by a PLC control driver and the motor, PCBs are automatically conveyed by an input conveying belt rack, the PCBs are picked by a slide table structure, soldering flux (rosin water) is sprayed automatically, automatic tin dipping in a tin furnace is performed, and inclination, falling and the like of electronic elements on the PCBs, which are not subjected to tin dipping, during moving are avoided by motor speed reduction, buffering and the like.