The invention relates to the technical field of PCB manufacturing, in particular to a manufacturing method of a PCB with a base copper-free metallized blind hole. The manufacturing method comprises the following steps: firstly manufacturing a metallized blind hole, then performing pattern plating, adopting a depth controlled milling manner to remove a copper layer at the bottom of the hole before outer layer etching, and then etching the copper edge remaining at the bottom of the metallized blind hole through the outer layer etching, so that the milled edge is smooth, the problems that the copper edge remaining at the bottom of the base copper-free metallized blind hole is large in area and coarse can be avoided, and the quality of the base copper-free metallized blind hole is greatly improved; setting the perpendicular distance between the milled edge and the wall of the metallized blind hole to be 0.01-0.02 mm, and enabling the milled edge after outer layer etching to be basically flush with the hole wall; setting the depth controlled milling to be 0.1-0.11 mm deeper than the metallized blind hole, so as to ensure that the copper layer at the bottom of the hole is completely removed, and no influence is generated due to nonuniformity of the copper layer.