The invention belongs to the technical field of circuit board manufacturing, and discloses a technological method for outer layer circuit board resin hole plugging of a multi-layer circuit board. The technological method for outer layer circuit board resin hole plugging of the multi-layer circuit board comprises the steps of a preceding process, resin hole drilling and plugging, copper deposition for the first time, board electroplating for the first time, resin hole plugging, copper reducing, board grinding with an abrasive belt, holes drilling in an outer layer, copper deposition for the second time, board electroplating for the second time, graph forming on an outer layer, electroplating on the graphs, etching on the outer layer and a post process. According to the technological method for the outer layer circuit board resin hole plugging of the multi-layer circuit board, through the methods that copper of resin hole plugging is plated enough at one time, and the copper reducing is conducted after the resin hole plugging is finished, accordingly, not only are the problems that the board copper foil of the outer layer circuit board is too thick, the etching is difficult to control, and circuit design requirements are difficult to meet solved, but also compared with an existing hole plating method, the technological process is greatly simplified, and the production cost is greatly reduced.