The invention discloses an IC chip die cutting device. The IC chip die cutting device comprises a machine base, a left supporting seat, a right supporting seat, a top plate, a hydraulic cylinder, an upper die plate, an upper cutting die, a lower cutting die and a conveyor. Compared with the prior art, resin containing an IC chip is placed on the lower cutting die, the upper cutting die is pushed to descend by the hydraulic cylinder, the upper cutting die and the lower cutting die cut the resin containing with the IC chip into pieces, the pieces fall on the top of the conveyor, and the IC chip pieces are conveyed by the conveyor. By manual sorting and packaging, the production efficiency is improved, manual collecting is avoided, and the unexpected casualty is prevented from happening.