The invention discloses a method for manufacturing a circuit board with a side face metal structure. The method aims to overcome the defects existing in an existing circuit board side face metallization process. The method includes the steps that a circuit base board including at least one circuit board unit is provided; at least one group, namely two through holes are formed in at least one boundary line of the peripheral regions of the circuit board units; edge slots formed in the circuit board unit regions and adjacent to the boundary lines are formed in the circuit base board, the two ends of each edge slot are adjacent to and connected with the corresponding two through holes respectively, but the edge slots are not communicated with the two through holes; the two through holes are filled with resin or metal slurry and cured; the inner walls of the edge slots are metalized, and metalized side walls of the circuit board units are formed; the circuit base board is cut, and the cutting path passes through the two through holes and the adjoining positions of the edge slots and the two through holes; the adjoining positions of the edge slots and the two through holes are removed through drilling.