The invention discloses an organic light-emitting device packaging method, which comprises steps: an organic light-emitting substrate is provided; multiple organic material layers and multiple inorganic material layers are alternatively deposited on the organic light-emitting substrate, and a blocking layer is formed; a perhydropolysilazane (PHPS) solution is coated on the blocking layer to form a liquid sealing layer, and in a 15 to 35 DEG C temperature condition, part of the perhydropolysilazane solution is reacted with water and oxygen in wet air to generate dense silicon dioxide. The invention also provides an organic light-emitting device packaging structure. According to the organic light-emitting device packaging structure and the packaging method, the perhydropolysilazane solution is adopted as a reactant, as a large number of reactive groups Si-H and N-H exist in the perhydropolysilazane structure, the perhydropolysilazane can react with water and oxygen at normal temperature to form dense silicon dioxide, low-temperature conversion can be realized, the dense silicon dioxide well adhered to the blocking layer can be acquired, and the structure has the advantages of corrosion resistance, gas isolation, long-term weather resistance, high and low-temperature resistance, transparency, and scratching resistance.