The application relates to a method for a repairing printed circuit trace and equipment. A method for material deposition comprises providing a transparent donor substrate, which is provided with oppositely disposed first and second surfaces, and a donor film formed on the second surface. The thickness of the donor film is [delta], the thermal diffusivity of the donor film is [alpha], and the thickness and the thermal diffusivity are represented through a thermal diffusion time [tau]=( [delta]<2>/4[alpha]). The donor substrate is positioned to be closer to a receptor substrate, and the second surface faces the receptor substrate. A pulse radiated by laser having a pulse continuous time not more than two times of the thermal diffusion time of the donor film is guided to pass through the first surface of the donor substrate and impact on the donor film so that droplets of a molten material is induced to injected from the donor film to the receptor substrate.