利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN104798197A 双排四方扁平无引线半导体封装 失效 - 权利终止 转让

双排四方扁平无引线半导体封装
摘要：
本公开的各个实施例涉及双排四方扁平无引线半导体封装。本公开的一些实施例提供了一种四方扁平无引线封装，其包括：布置在四方扁平无引线封装底表面外周上的外周引线的外排；以及布置在四方扁平无引线封装底表面内周上的内周引线的内排，其中每个内周引线具有基本上矩形的形状，并且其中该基本上矩形的形状具有两个与外周引线的外排相邻的圆化的角部。
摘要（英）：

Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, and wherein the substantially rectangular shape has two rounded corners adjacent to the outer row of outer peripheral leads.

公开/授权文献
0/0