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CN104823293A 具有最小顶板寄生电容的可堆叠高密度金属-氧化物-金属电容器 失效 - 权利终止

具有最小顶板寄生电容的可堆叠高密度金属-氧化物-金属电容器
摘要：
公开了一种系统，该系统包括在衬底上沿着第一轴被堆叠的第一多个导体和第二多个导体(M2…M6)。第一轴垂直于衬底位于其上的平面。在第一多个导体和第二多个导体中，每个导体通过沿着第一轴布置的一个或多个第一通孔(V23…V56)连接至相邻导体。第一多个导体和第二多个导体沿着垂直于第一轴并且平行于衬底位于其上的平面的第二轴被平行布置。第一多个导体分别位于垂直于第一轴并且平行于衬底位于其上的平面的多个平面上。第二多个导体分别位于多个平面上。沿着多个平面在第一多个导体与第二多个导体之间形成电容。
摘要（英）：

Disclosed is a system including first and second plurality of conductors (M2...M6) stacked along a first axis on a substrate. The first axis is perpendicular to a plane on which the substrate lies. In the first and second plurality of conductors, each conductor is connected to an adjacent conductor by one or more first vias (V23...V56) arranged along the first axis. The first and second plurality of conductors are arranged in parallel along a second axis perpendicular to the first axis and parallel to the plane on which the substrate lies. The first plurality of conductors respectively lie on a plurality of planes perpendicular to the first axis and parallel to the plane on which the substrate lies. The second plurality of conductors respectively lie on the plurality of planes. Capacitances are formed along the plurality of planes between the first plurality of conductors and the second plurality of conductors.

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