The invention discloses silicon resin with adhesive properties and a preparation method of the silicon resin. The silicon resin is prepared by the following steps: reacting trialkoxysilane, dialkoxyl silane, epoxy alkyl silane, (methyl) acryloyloxy silane, a boron-containing compound and an end-capping reagent in water and an organic solvent environment under the action of an acid as a catalyst; and separating an organic layer; and washing to be neutral and then drying, so as to obtain colorless transparent organic silicon resin. The silicon resin disclosed by the invention has good compatibility with an ordinary organosilicone LED encapsulating material, is capable of significantly improving the adhesive property of the solidified organosilicone LED encapsulating material and a base material when being applied to the organosilicone LED encapsulating material, is colorless and transparent, does not affect the luminous efficiency of solidified encapsulating glue, is simple to operate in preparation process, available in raw material, low in cost, mild in reaction condition, simple in process and high in operability; and industrialized production is easy to realize.